Details:

XF for superfine grinding: Used to polish nail surface protruding and dead skin, suitable for manicure before grinding nail surface.

F for fine grinding: Used to remove bottom glue, all kinds of extended nail repair and grinding, will not wear too deep to the true nail.

M for medium grinding: Used for unloading soft glue and all kinds of nail tablets, the use is relatively common.

C for crude grinding: Nail removal faster.

XC for oversize grinding: Used to remove all kinds of hard glue, it is recommended to use the grinder skilled operator.

Use:Used to remove phototherapy glue, extended glue, crystal nail, etc., the head grinding grain gradually become thinner, can be operated more flexibly at multiple angles. The pointed round design does not hurt the surrounding skin.