Details:

XF for superfine grinding: Used to polish the raised and dead skin of the nail surface and smooth the nail surface.

F for fine grinding: Used to remove bottom glue, all kinds of extended nail repair and grinding, will not wear too deep to the true nail.

M for medium grinding: Used for unloading soft glue and all kinds of nail tablets, the use is relatively common.

C for crude grinding: Nail removal faster.

XC for oversize grinding: Used to remove all kinds of hard glue, it is recommended to use the grinder skilled operator.

Use:Used to remove nail polish glue and modify nail around the glue, head grinding gradually finer, can be more flexible multi-angle operation. The pointed round design does not hurt the surrounding skin.