Details:XF for superfine grinding: Used to polish nail surface protruding and dead skin, suitable for manicure before grinding nail surface.

F for fine grinding: Used to remove bottom glue, all kinds of extended nail repair and grinding, will not wear too deep to the true nail.

M for medium grinding: Used for unloading soft glue and all kinds of nail tablets, the use is relatively common.

C for crude grinding: Nail removal faster.

Use:Used for removing phototherapy glue, nail polish glue, etc., the design of the pointed round head will not hurt the surrounding skin, the umbrella design makes the grinding pattern more close to the nail, the speed of unloading nail is fast, and the range of use is wide.